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WYLIE WL-108 CPU Underfill Adhesive For iPhone
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SKU: ECS067556

WYLIE WL-108 CPU Underfill Adhesive For iPhone

Availability: In stock
Quantity:
€7,50

tutti strumenti ed attrezzi no cambio reso  all tools, tools, no return exchange 所有工具购买后不退换 WL-108 CPU  UNDERFILL ADHESIVE FOR IPHONEMATTE BLACK 2 MLORIGINAL SEALANTNO AIR GUN HEATING REQUIREDCOMPLETE SOLIDIFICATION IN 30 MIN.CAUTION: NEED TO BE REFRIGERATED WYLIE WL-108 BGA IC Chip Glue CPU Underfill Adhesive For iPhone Nand  Touch IC Hard Disk Repair Filler Glue    

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