You have no items in your shopping cart.
Multifunctional Positioning Pressure-Reducing Protective Pad For BGA RepairingBGA Chips Repairing Pressure-Reducing Protecting Pad Product Detail: Silicone material resistant to high temperature Specifically designed for repairing BGA chips of electronic products Effectively avoid tin messing caused by the deformation of steel mesh Multiple component slots Product Pack: Magic Pad*1
