Wylie WL-70 BGA Reballing Stencil For HUAWEI Mate 30/30Pro/RS/Nova 6/Honor V30/V30Pro Kirin990 HI3690 CPU RAM Power WiFi
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SKU: ECS058322

Wylie WL-70 BGA Reballing Stencil For HUAWEI Mate 30/30Pro/RS/Nova 6/Honor V30/V30Pro Kirin990 HI3690 CPU RAM Power WiFi

Razpoložljivost: Na zalogi
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€6,00

Wylie WL-70 BGA Reballing Stencil For HUAWEI Mate 30/30Pro/RS/Nova 6/Honor V30/V30Pro Kirin990 HI3690 CPU RAM Power WiFi IC Chip

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