{"product_id":"bga-tool-mijing-kc8","title":"BGA Tool Mijing KC8","description":"BGA Tool Mijing KC8 Mijing KC8 is a multifunctional tool designed for scraping, cleaning adhesive residues from components, and easily removing small parts such as CPU, NAND, or Wi-Fi chips from phones. The set includes 8 replaceable blades made of high-carbon flexible steel, providing both durability and precision. The choice of blades is extremely important, as using the wrong one can damage delicate components. Specifications: - Multifunctional design for scraping, cleaning, and chip removal - Includes 8 interchangeable high-carbon steel blades - Flexible and durable material for precise work - Ideal for removing CPU, NAND, and Wi-Fi components - Essential tool for electronic repair and maintenance","brand":"Phonepartseurope","offers":[{"title":"Default","offer_id":61576731590990,"sku":"ECS094837","price":24.5,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0273\/8913\/2845\/files\/f58d7a2d7a5909d50113729f81d0cfda.jpg?v=1794024712","url":"https:\/\/phone-parts.eu\/hr\/products\/bga-tool-mijing-kc8","provider":"Phonepartseurope","version":"1.0","type":"link"}